Application Processor Market - Smartphone: Qualcomm Snapdragon, Samsung Exynos, Apple A

 Hello everyone, welcome to Semicon Talk. Today’s topic is market of smartphone application processor. What is an application processor ? If you look at the smartphone board, there is a big package at the center of the board. That is an application processor and Qualcomm Snapdragon for this case.

Typically it has Package on Package structure  so mobile DRAM package is located on top of application processor. Application processor is like a brain in the smartphone and it performs key functions. So it has CPU, GPU, Audio and Video engine, Connectivity, and Modem. It is System on Chip format means all these functions are integrated in one chip.

This is Global Smartphone Application Processor Market Share for 2Q 2019 and 2020. Market share in 2020 is little big different than usual because of Covid-19 pandemic and trade war between China and USA. This is Market Share for 3Q 2019 and 2020. As you can see there are 5 major players, MediaTek, Qualcomm, HISILICON, Samsung, and Apple.

Among these 3 players - Qualcomm, Samsung, and Apple are key players for premium smartphone market which is the most expensive smartphone category. Let’s start with Qualcomm.

This is Qualcomm Snapdragon 888. It is the latest application processor from Qualcomm for premium smartphone.

It has CPU, GPU, ISP, and Modem. Especially for Modem this Snapdragon AP supports 5G. This chip is manufactured using 5nm Samsung foundry.

Usually Qualcomm Snapdragon 800 series AP use MCeP package technology from Shinko. This package structure has top substrate and Cu core solder ball between top and bottom substrate.

Qualcomm Snapdragon 888 AP is used for many smartphones over the world. And it includes smartphones from Samsung, Xiaomi, iQOO, Vivo, Realme, and OPPO. 2nd player is Samsung  and Exynos 2100 is the latest AP.

Like Qualcomm Snapdragon it has CPU, GPU, Modem, DSP, Audio, Video, and others. It also supports 5G communication. This chip is manufactured using 5nm EUV from Samsung foundry. Samsung Exynos Series usually use Interposer PoP, Package on Package. It has Interposer on top of Application Processor and it is like top substrate of MCeP for Qualcomm Snapdragon.

Samsung Exynos Series is used for smartphones from Samsung, Vivo, and Meizu. 3rd player is Apple. Its AP is A series. Apple A14 Bionic is the latest Application Processor from Apple. It has CPU, GPU, and NPU.

NPU is for A.I., Artificial Intelligence. This chip is manufactured using 5nm TSMC technology. Nowadays Apple A series use TSMC InFO, Fan Out technology for packaging.

Fan Out does not use package substrate and use RDL, Redistribution Layer for electrical interconnection. Apple A series Application Processor is used only for Apple iPhones. It is not used for other smartphones. In summary, 1. Qualcomm Snapdragon, Samsung Exynos, Apple A series are major Application Processors for premium smartphones.

2. Qualcomm Snapdragon is used for Samsung, Xiaomi, iQOO, Vivo, Realme, OPPO. 3. Samsung Exynos is used for Samsung, Vivo, Meizu 4. Apple A series is used only for Apple iPhone.

Thanks for watching and have a nice day, bye bye..